1. Raw Material Screening and Inspection
High-purity electrolytic copper (purity ≥99.95% oxygen-free copper) is selected as raw material, conforming to GB/T 467 national standard, with impurities Fe, Pb, and Bi ≤0.005% for each.impurities, resistivity, and oxygen content are detected by spectrophotometry to remove substandard copper materials and ensure conductivity.raw material pretreatment: Remove surface oil, oxide scale, and moisture, and dry for later use to avoid porosity during smelting.
2. Smelting, Continuous Casting and Rolling (Preparation of Copper Rod Billets)
Smelting is carried out in an induction furnace at a temperature of 1100–1200℃. Phosphorus copper is added for deoxidation to reduce the oxygen content of the copper liquid and prevent brittle fracture of the copper wire later.continuous casting produces Φ8mm copper billets, which are then hot-rolled into standard Φ2.6mm electrical copper rods (basic billets for wire drawing).the copper rods are coiled and cooled, the oxide layer is wiped off the surface, and the rods are stored for later use.
3. Multi-stage Wire Drawing (Core Diameter Reduction Process, Divided into Coarse/Medium/Fine Drawing)
Wire Drawing Principle: The copper rod passes through progressively smaller diamond/hard alloy drawing dies, undergoing cold drawing and diameter reduction with full lubrication and cooling.coarse Drawing: Φ2.6mm copper rod is drawn to 0.8–1.0mm using high-speed, large-diameter dies and water-soluble drawing oil for lubrication and cooling.medium Drawing: The coarse-drawn copper wire is further drawn to 0.1–0.8mm, with improved die precision and strict control of wire diameter tolerance.fine/Micro Drawing: For ultra-fine electronic copper wire, drawn to 0.03–0.2mm using nano-coated dies, with a wire diameter error ≤±0.001mm.process Characteristics: Cold drawing causes work hardening, making the copper wire harder and more brittle. Intermediate annealing is necessary when drawing to certain specifications.